1) 通过灌胶,能将元件热量导出,并通过外壳散出,使内部温度均匀,降低整体温度。
Contact: Victor Yin
Phone: 18917992510
Tel: 021-67871276
Email: lskj@shlskj.com
Add: Zhenye Road No.2 Songjiang District, Shanghai, China